MySem is equipped with the state-of-the-art failure analysis equipment to support its fabrication facility to diagnose the cause of any failure. Our failure analysis facility can both support wafer and package level process failure analysis. Failure analysis by us is an ideal service for the regional semiconductor industry as it offers shorter turn around time, fair prices and with the experience that we had gathered all these years, we are familiar with wafer fab process and problems. Hence we can guarantee you with high standards of quality in our analysis. As our FA is efficient, several MNC have used our facility since we offered our FA to external parties.

Failure analysis can be defined as a diagnostic process for determining the cause of a failure. It is designed to:

• Identify the failure modes (the way the product failed);
• Identify the failure site (where in the product failure occurred);
  
• Identify the failure mechanism (the physical phenomena involved in the failure);
  
• Determine the root cause (the design, defect, or loads which led to failure); and
  
• Recommend failure prevention methods.

We offer equipment specific services, material analysis, construction analysis, circuit modification, and defect localization. Feel free to contact us for further information about our FA service.